AI Chip Packaging Complexity
The semiconductor industry is experiencing a surge in equipment orders due to the increasing complexity of AI chip packaging.
TSMC is driving development beyond the 2nm process node and expanding mass production of advanced technologies such as CoWoS-L, SoIC, and next-gen WMCM and CoPoS.
The semiconductor industry is entering a "complexity explosion" phase in advanced packaging, boosting high-end AI chip performance and power efficiency.
Author's summary: TSMC accelerates AI chip development.
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