GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, and TIER IV have joined imec's Automotive Chiplet Program (ACP), accelerating the development of cutting-edge chiplet architecture for the automotive industry.
As vehicles become high-performance, software-defined platforms, traditional monolithic chip designs struggle to meet the demands of advanced driver assistance systems (ADAS), autonomous driving, and in-vehicle infotainment.
Accelerating the development and adoption of a cutting-edge chiplet architecture tailored to the unique demands of the automotive industry.
Author's summary: imec expands Automotive Chiplet Program with new partners.