GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, TIER IV join imec Automotive Chiplet Program

imec Automotive Chiplet Program Expansion

GlobalFoundries, Infineon, Silicon Box, STATS ChipPAC, and TIER IV have joined imec's Automotive Chiplet Program (ACP), accelerating the development of cutting-edge chiplet architecture for the automotive industry.

As vehicles become high-performance, software-defined platforms, traditional monolithic chip designs struggle to meet the demands of advanced driver assistance systems (ADAS), autonomous driving, and in-vehicle infotainment.

Accelerating the development and adoption of a cutting-edge chiplet architecture tailored to the unique demands of the automotive industry.

Author's summary: imec expands Automotive Chiplet Program with new partners.

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DATAQUEST DATAQUEST — 2025-10-24

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